This topical review discusses recent development and trends on scanning micromirrors for biomedical applications. This also includes a biomedical micro robot for precise …
Z Wang - Microelectronic Engineering, 2019 - Elsevier
As a powerful enabling technology, three-dimensional (3D) integration, which uses wafer bonding to integrate multiple wafers in the vertical direction and uses through‑silicon-vias …
Y Tang, J Li, L Xu, JB Lee, H Xie - Micromachines, 2022 - mdpi.com
Electrothermal micromirrors have become an important type of micromirrors due to their large angular scanning range and large linear motion. Typically, electrothermal micromirrors …
J Sun, H Xie - International Journal of Optics, 2011 - Wiley Online Library
Early cancer detection has been playing an important role in reducing cancer mortality. Optical coherence tomography (OCT), due to its micron‐scale resolution, has the ability to …
SR Samuelson, L Wu, J Sun, S Choe… - Journal of …, 2012 - ieeexplore.ieee.org
This paper reports a miniature optical coherence tomography (OCT) probe and high- resolution 3-D OCT imaging results obtained with this side-view probe. The probe is only 2.8 …
T Chen, N Zhang, T Huo, C Wang… - … of biomedical optics, 2013 - spiedigitallibrary.org
We present an endoscopic probe for optical coherence tomography (OCT) equipped with a miniaturized hollow ultrasonic motor that rotates the objective lens and provides an internal …
L Liu, S Pal, H Xie - Sensors and Actuators A: Physical, 2012 - Elsevier
A curved concentric electrothermal actuator has been designed and developed to actuate circular micromirrors with improved area efficiency, while at the same time achieving large …
S Luo, D Wang, J Tang, L Zhou, C Duan… - Biomedical Optics …, 2018 - opg.optica.org
We present a novel circumferential-scan endoscopic optical coherence tomography (OCT) probe by using a circular array of six electrothermal microelectromechanical (MEMS) mirrors …
L Xiao, Y Ding, Y Su, Z Zhang, Y Yan… - IEEE Electron Device …, 2022 - ieeexplore.ieee.org
Ultra-deep through-silicon-vias (TSVs) are of great demand for 3D heterogeneous integration. However, most reported deep TSVs adopt double-sided silicon etching and …