Volumetric nondestructive metrology for 3D semiconductor packaging: A review

Y Su, J Shi, YM Hsu, DY Ji, AD Suer, J Lee - Measurement, 2024 - Elsevier
Abstract Three-dimensional (3D) semiconductor packaging has the potential to overcome
Moore's Law for future integrated circuits (ICs), but the inspection and testing of 3D ICs to …

Virtual metrology for enabling zero-defect manufacturing: a review and prospects

Y Zhang, L Li, Q Yu - The International Journal of Advanced Manufacturing …, 2024 - Springer
The ultimate objective of “Zero-Defect Manufacturing,” as a new growth step of Industry 4.0,
is to significantly increase product yield and eventually accomplish zero-defect. For product …

Developing the Keep-Important-Samples Scheme for Training the Advanced CNN-based Automatic Virtual Metrology Models

YM Hsieh, CT Liu, SY Huang, C Li… - IEEE Robotics and …, 2024 - ieeexplore.ieee.org
Virtual Metrology (VM) technology can convert offline sampling inspection into online and
real-time total inspection. As the processes of high-tech industries (semiconductor or TFT …

面向制造过程的虚拟量测技术综述与展望

李莉, 张雅瑄, 于青云 - 信息与控制, 2023 - xk.sia.cn
“零缺陷制造” 作为工业4.0 的拓展, 致力于大幅提升产品良率并最终实现产品零瑕疵. 目前,
工业过程通常采取物理检测方式对产品进行质量检验, 属于离线破坏性试验且检测成本高昂 …

[PDF][PDF] Recent Advancements in Artificial Intelligence driven Cloud Computing

SS Pallapuneedi, VKR Kondapalli - 2024 - techrxiv.org
Artificial Intelligence (AI) and Cloud Computing (CC) are revolutionary technologies adopted
by a wide variety of industries for managing and processing data. The integration of AI and …

Virtual Metrology Based on Graph Convolutional Neural Network for Semiconductor PVD Process

L Zhou, D Jin, S Chen, J Yang… - 2024 5th International …, 2024 - ieeexplore.ieee.org
Physical Vapor Deposition (PVD) is a critical technique extensively utilized to deposit thin
films onto semiconductor wafers. The thickness of films is a crucial metric that needs to be …

[引用][C] LCD 面板C/FOG 工艺制造虚拟计量方法研究

刘暾东, 黄智斌, 高凤强, 郑鹏, 谢玉练 - 仪器仪表学报, 2024