A novel subsurface damage model in diamond wire sawing of silicon wafers
H Xiao, S Yin, CF Cheung, P Zhou - Engineering Fracture Mechanics, 2024 - Elsevier
The subsurface damages (SSDs) generated during fixed abrasive diamond wire sawing
(DWS) of silicon wafers can reduce the fracture strength and increase the breakage …
(DWS) of silicon wafers can reduce the fracture strength and increase the breakage …
Experimental Investigation into Double-disc and Chemically Assisted Magnetorheological Finishing Process
A new hybrid finishing process, namely, double-disc chemical-assisted magnetorheological
finishing (DDCAMRF) process has been developed for the polishing of monocrystalline …
finishing (DDCAMRF) process has been developed for the polishing of monocrystalline …