Thermal shock and drop test performance of lead-free assemblies with no-underfill, corner-underfill and full-underfill
BV Chheda, SM Ramkumar… - 2010 Proceedings 60th …, 2010 - ieeexplore.ieee.org
A wide array of lead-free alloys is available in the market and distinguishing one over the
other is not an easy task. Several factors have to be considered before making a choice …
other is not an easy task. Several factors have to be considered before making a choice …
Epoxy Flux–A Low Cost High Reliability Approach for PoP Assembly
NC Lee - International Symposium on Microelectronics, 2011 - meridian.allenpress.com
Package on package (PoP) is a packaging that rapidly prevails in mobile devices of the
electronic industry, due to its flexibility in combining memory and processor into one …
electronic industry, due to its flexibility in combining memory and processor into one …
Low-cost high-reliability assembly of thermally warped PoP with novel epoxy flux on solder paste
M Hu, L Kresge, NC Lee - 2013 14th International Conference …, 2013 - ieeexplore.ieee.org
A novel epoxy flux EF-A was developed with good compatibility with no-clean solder pastes,
and imparts high reliability for BGA assembly at a low cost. This compatibility with solder …
and imparts high reliability for BGA assembly at a low cost. This compatibility with solder …
[PDF][PDF] A novel epoxy flux on solder paste for assembling thermally warped POP
DRNC LEE - Proceedings of 2013 IMAPS, 2013 - circuitnet.com
A novel epoxy flux EF-A was developed with good compatibility with no-clean solder pastes,
and imparts high reliability for BGA assembly at a low cost. This compatibility with solder …
and imparts high reliability for BGA assembly at a low cost. This compatibility with solder …
Thermal Shock and Drop Test Behaviour of Area Array Packages in Forward and Backward Compatible Assemblies
BV Chheda, S Sakthivelan… - International …, 2009 - asmedigitalcollection.asme.org
With lead-free implementation it is important to examine the behaviour of the solder joint at
the component level and at the board level. Assembly related issues along with component …
the component level and at the board level. Assembly related issues along with component …
[PDF][PDF] Low Cost High Reliability Assembly of POP with Novel Epoxy Flux on Solder Paste
M Hu, L Kresge, NC Lee, NY Clinton - ipc.org
A novel epoxy flux was developed with good compatibility with no-clean solder pastes,
which imparts high reliability for BGA assembly at a low cost. This compatibility with solder …
which imparts high reliability for BGA assembly at a low cost. This compatibility with solder …
A novel epoxy flux on solder paste for assembling thermally warped POP
M Hu, L Kresge, NC Lee - International Symposium on …, 2013 - meridian.allenpress.com
A novel epoxy flux EF-A was developed with good compatibility with no-clean solder pastes,
and imparts high reliability for BGA assembly at a low cost. This compatibility with solder …
and imparts high reliability for BGA assembly at a low cost. This compatibility with solder …