(57) ABSTRACT A sensor network collects time-series data from a process tool and
Supplies the data to an analysis system where pattern analysis techniques are used to …

After a hole is formed in a polishing pad, a transparent window plate is inserted into the hole.
Here, a gap is left between the upper Surface of the transparent window plate and the …

A method and apparatus for processing a microelectronic workpiece using metrology. The
apparatus can include one or more processing or transport units, a metrology unit, and a …

The disclosure is directed to polishing pads with porous pol ishing elements, and to methods
of making and using such pads in a polishing process. In one exemplary embodiment, the …

192g tions or a composite model. Time-series data from multiple process runs are used to
form a composite model of a data structure including variation. Comparison with the compos …

5,658,183 A 8/1997 Sandhu et al. control, Signal-connected to the metrology unit. An electro
5,872,633 A 2/1999 Holzapfel et al. chemical deposition unit provides a Space to receive …

The polishing pad is suitable for polishing or planarizing at least one of semiconductor,
optical and magnetic substrates. The polishing pad has a polishing surface, an opening …

Embodiments of the present disclosure relate to advanced polishing pads with tunable
chemical, material and structural properties, and new methods of manufacturing the same …

Embodiments described herein relate to integrated abrasive (IA) polishing pads, and
methods of manufacturing IA polishing pads using, at least in part, surface functionalized …

Embodiments described herein relate to methods of detect ing a polishing endpoint using
one or more sensors embed ded in the polishing material of a polishing pad, the polish ing …