Application of Ferroelectric capacitors for Equalization of High-Speed Digital Signaling
This article demonstrates a novel passive equalizer topology for differential transmission
lines, based on a ferroelectric capacitor. The use of this three-terminal commercial …
lines, based on a ferroelectric capacitor. The use of this three-terminal commercial …
A novel structured spiral planar embedded inductor: Electroless-plating NiCoP alloy on copper coil as magnetic core
G Zhou, W Zhang, D He, X Li, S Wang, Y Hong… - Journal of Magnetism …, 2019 - Elsevier
In this work, electroless-plating of magnetic film directly on planar spiral copper coil to
fabricate embedded inductor was designed and realized by introducing NiCoP alloys as its …
fabricate embedded inductor was designed and realized by introducing NiCoP alloys as its …
High density on-package direct cable attachment for hundred-Gbps chip-to-chip interconnects
B Wu - 2018 19th International Conference on Electronic …, 2018 - ieeexplore.ieee.org
A high speed package I/O breakout solution is proposed by using dense and direct cable-
package attachment for hundred-gbps chip interconnects. As the method utilizes coplanar …
package attachment for hundred-gbps chip interconnects. As the method utilizes coplanar …
Built-in Ring Transmission Line Structure for Signal Integrity Optimization of PAM4 Signaling in PCBs
HK Le, H Van Nguyen, Y Han… - IEEE Transactions on …, 2021 - ieeexplore.ieee.org
In this article, we propose a built-in ring differential transmission line for four-level pulse
amplitude modulation (PAM4) signal integrity optimization. An optimized ring structure …
amplitude modulation (PAM4) signal integrity optimization. An optimized ring structure …
Embedded package inductor for high speed SerDes design
An embedded inductor structure is introduced in the high speed IC package design. The
inductor under the IC bumps serves a key signal integrity enabler for high speed IO, such as …
inductor under the IC bumps serves a key signal integrity enabler for high speed IO, such as …
Tunable Equalizer for Improving Signal Integrity in High-Speed Applications
A Gupta - 2023 - search.proquest.com
When a signal is transmitted, the received signal will always be distorted because of
impedance mismatching and other effects. Therefore, we must work towards minimizing …
impedance mismatching and other effects. Therefore, we must work towards minimizing …
Substrate integrated common mode choke of EMI filter for high speed serial link
B Wu - 2017 IEEE 26th Conference on Electrical Performance …, 2017 - ieeexplore.ieee.org
A miniaturized substrate integrated common mode chock of EMI filter is presented for high
speed serial link. This novel design is implemented on a high density interconnect board …
speed serial link. This novel design is implemented on a high density interconnect board …
Micro-Cables out of High-Speed Communication Chip through Embedded Wires in the Package Substrate
B Wu - 2018 IEEE CPMT Symposium Japan (ICSJ), 2018 - ieeexplore.ieee.org
A high speed chip package I/O breakout solution is developed by using direct cable-
package attachment through dense embedded wires in the substrate for hundred-Gbps chip …
package attachment through dense embedded wires in the substrate for hundred-Gbps chip …
Direct Cable Access to Chip Package through Dense Wires Embedded in the Substrate
B Wu - 2018 13th International Microsystems, Packaging …, 2018 - ieeexplore.ieee.org
A high speed chip package I/O breakout solution is developed by using direct cable-
package attachment through dense embedded wires in the substrate for hundred-Gbps chip …
package attachment through dense embedded wires in the substrate for hundred-Gbps chip …