Low Thermal Budget Fine-pitch Cu/Dielectric Hybrid Bonding with Cu Microstructure Modifications

HK Cheemalamarri, TVN Anh, CG Guan… - 2024 IEEE 74th …, 2024 - ieeexplore.ieee.org
Advanced packaging featuring vertical integration has emerged as a crucial technology
facilitating high performance, low power consumption, and compatibility for heterogeneous …