This paper reviews the latest developments in microwave acoustic wave devices. After an
introduction and brief history of bulk acoustic wave (BAW) and surface acoustic wave (SAW) …

We present a new temperature compensation system for microresonator-based frequency
references. It consists of a phase-locked loop (PLL) whose inputs are derived from two …

We have developed a single-wafer vacuum encapsulation for microelectromechanical
systems (MEMS), using a thick (20-mum) polysilicon encapsulation to package …

Packaging of micro-electro-mechanical systems (MEMS) devices has proven to be costly
and complex, and it has been a significant barrier to the commercialization of MEMS. We …

The stability of resonant frequency for single wafer, thin-film encapsulated silicon MEMS
resonators was investigated for both long-term operation and temperature cycling. The …

(57) ABSTRACT A method for making a pressure Sensor by providing a wafer including a
base Silicon layer, a buried Sacrificial layer, and a top Silicon layer. The top Silicon layer is …

Although 2D materials hold great potential for next-generation pressure sensors, recent
studies revealed that gases permeate along the membrane-surface interface, necessitating …

Vacuum and hermetic packaging is a critical requirement for optimal performance of many
micro-electromechanical systems (MEMS), vacuum electronics, and quantum devices …

MEMS (Microelectromechanical) oscillators were first introduced commercially six years
ago. Now MEMS is making significant incursions into what was once the exclusive territory …

Micromechanical resonators with resonant frequencies from 500 kHz to 10 MHz were built
and examined for several energy loss mechanisms. Thermoelastic damping, clamping loss …