The application of the electron backscatter diffraction technique to the investigation of phase
transformations is reviewed. The wide variety of results obtained using this technique is …

The present study summarizes the effects of processing conditions and substrate cleaning
procedures on the structure, chemistry and bonding of Cu/(0001) Al 2 O 3 interfaces as …

Thermal stability and reaction properties of Al–CuO system, a mixture of 50–200nm
aluminum nanoparticles passivated by nitrocellulose and 12nm copper (II) oxide, were …

Polycrystalline copper was used as catalyst for the selective oxidation of methanol under
stoichiometric reaction conditions for oxidehydrogenation. Temperature-programmed …

The wetting of CuO and AuCuO alloys on alumina single-crystals and the surface free
energy of these liquids have been determined as a function of oxygen activity. The explored …

Infiltration of alumina powder compacts by molten copper‐oxygen alloys under controlled
oxygen partial pressures has been studied. Spontaneous infiltration occurred for copper …

Alumina has been joined at 1150° C and 1400° C using multilayer copper/niobium/copper
interlayers. Four-point bend strengths are sensitive to processing temperature, bonding …

In this study, alumina ceramics were joined by spark plasma sintering technology using
zirconium and titanium metals as interlayers. Bonding with Zr was achieved at 800 and 900° …

Adhesive energetics and interfacial electronic structures have been computed from first
principles for the Cu/Al 2 O 3 interface. Recent transmission electron microscopy results of …

The interfacial reactions between Cu and Al2O3 which occur during the eutectic bonding
process have been examined. A thermodynamic analysis of phase equilibria in the Cu–Al–O …