A Cu–carbon hybrid interconnect was recently proposed as an alternate interconnect structure for future VLSI applications because of its superior electrical performance over its …
G Bhatti, T Pathade, Y Agrawal… - IETE Journal of …, 2024 - Taylor & Francis
At nanometer technology nodes, the efficient signal integrity and performance assessment of vast on-chip interconnects are crucial and challenging. For a long time, copper (Cu) has …
To exploit the superior performance of copper and graphene interconnects, hybrid interconnects are seen as a promising interconnect technology for future technology nodes …
In recent 3-D integrated circuits, tapered-shaped bumps (T-bump) have provided an appealing solution over the conventional cylindrical (C-bump) structures due to their …
B Gugulothu, BR Naik - 2022 International Conference for …, 2022 - ieeexplore.ieee.org
In this paper, the crosstalks induced effects are explored in mutually coupled multi-walled carbon nanotubes (MWCNTs) interconnect lines driven by CMOS gates. The crosstalk …
S Kumar, MK Majumder - Nanoscale Semiconductors, 2022 - api.taylorfrancis.com
In this chapter, we discuss the important role played by high-speed on-chip, that is, nanoscale interconnects in the design of integrated circuits and systems. Losses and …
Z Du, N Dong, YZ Xie - … Transactions on Circuits and Systems II …, 2023 - ieeexplore.ieee.org
This brief presents a behavioral macromodeling method for electronic or electrical interconnected systems, when there are frequency-characterized interconnects loaded by …