Example rack systems that Support computing platforms and related hardware are provided.
Multiple instances of the example rack system may be combined to create Scalable systems …

Abstract A three-dimensional (3D) chip stack structure and method of fabricating the
structure thereof are provided. The 3D chip stack structure includes a plurality of vertically …

(57) ABSTRACT A cooling device may include a fluid inlet manifold, a case body, and a fluid
outlet manifold that are formed of a molded polymer composite material. The fluid inlet …

An active array heat sink cooled by natural free convection is disclosed. A long extruded
heat sink is partitioned into multiple, shorter zones separated by gaps having horizontal …

An apparatus is provided including at least one electronic component. The apparatus also
includes an enclosure enclos ing the at least one electronic component. The enclosure …

BACKGROUND An active electronically scanned array (AESA) is a phased array antenna
that may be used on vessels such as Naval ships. An AESA may generally include an array …

A cooling device comprises an upper surface configured to contact the baseplate, an inlet
manifold configured to receive a coolant, an outlet manifold configured to exhaust the …

2006/0016581 AL 1/2006 Wang et al. 2006/0021736 A1 2/2006 Tran 2006/0042782 A1
3/2006 Chen 2006/0196638 A1 9/2006 Glezer et al. 2006/0267184 Al 11/2006 Kinsman et …

Cooling apparatuses and coolant-cooled electronic assemblies are provided which include
a thermal transfer structure configured to couple to one or more sides of an electronics card …

5,445,215 A 8/1995 Herbert JP 2006522479 A 9, 2006 5,477,371. A 12/1995 Shafir JP 2007
192210 A 8, 2007 5,568,260 A 10/1996 Schneiter JP 2008008230 A 1, 2008 5,570,186 A …