Transfer printing is becoming widely adopted as a back-end process for the hybrid
integration of photonic and electronic devices. Integration of membrane components, with …

Optical isolators provide one-way propagation and are necessary to protect laser diodes
from damage and unstable operation caused by reflected light. Although magneto-optical …

We propose and demonstrate an improved method for transfer printing that allows for the
accurate docking of a photonic crystal nanobeam (NB) laser onto a SiN x waveguide. Our …

We have fabricated III–V gain region/Si waveguide hybrid lasers with an InP-based two-
storied ridge structure using direct bonding technology. Continuous-wave operation at a …

The direct bonding process of InP chips on a silicon-on-insulator (SOI) wafer is investigated
using surface hydrophilization by UV-ozone treatment. The influence of the treatment on …

以光子为信息传输媒介的光子集成芯片, 具有高带宽, 高速率, 高灵敏度等优点, 在光通信,
光互联, 光学传感等领域得到了广泛的研究与应用. 为了进一步提高光子集成芯片的集成度 …

We propose and study the hybrid integration of a 1D photonic crystal (PhC) nanobeam (NB)
laser on a SiN x waveguide. With modifications by reduced-PhCs and a tapered beam to the …

A high-speed InP-based electro-absorption modulator (EAM) on 220 nm silicon-on-insulator
(SOI) is designed, fabricated, and measured. The III–V device is heterogeneously integrated …

The technology for heterogeneously integrating active III-V material structures on silicon
photonic platforms has gained considerable advancement in recent years. Most of the prior …

3D integration of GaSb-based gain chips on a silicon photonics platform using micro-transfer
printing is demonstrated for the first time. The release process of GaSb coupons, and their …