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Surface and a second Surface remote from the first Surface. A microelectronic element
overlies the first Surface and first electrically conductive elements are exposed at one of the …

(57) ABSTRACT A microelectronic unit includes a microelectronic element, eg, an integrated
circuit chip, having a semiconductor region of monocrystalline form. The semiconductor …

(57) ABSTRACT A method for making an interposer includes forming a plurality of wire
bonds bonded to one or more first surfaces of a first element. A dielectric encapsulation is …

A structure may include bond elements having bases joined to (51) Int. Cl. conductive
elements at a first portion of a first Surface and end HOIL 23/02(2006.01) surfaces remote …

US PATENT DOCUMENTS 3,358,897 A 12/1967 Christensen 3,623,649 A 1 1/1971
Keisling 3,795,037 A 3, 1974 Luttmer 3,900,153 A 8, 1975 Beerwerth et al. 4,327,860 A 5 …

A stacked microelectronic assembly is provided which includes first and second stacked
microelectronic elements. Each of the first and second microelectronic elements can include …

In die stack assembly configurations successive die in the stack are offset at a die edge at
which die pads are situated, and the die are interconnected by electrically conductive traces …

(57) ABSTRACT A method of making an assembly can include juxtaposing a top surface of a
first electrically conductive element at a first surface of a first substrate with a top surface of a …

(57) ABSTRACT A method of making a microelectronic package includes forming a
dielectric encapsulation layer on an in-process unit having a substrate having a first Surface …