Abstract The reliability of Sn-Ag-Cu (SAC)-based solder alloys has been extensively
investigated after the prohibition of lead in the electronics industry owing to their toxicity. Low …

This study aims to comprehensively understand the influence of bismuth (Bi) content on the
shear characteristics of solder joints under various aging conditions and strain rates. Three …

Reliability of conventional electronic assemblies in real service applications is typically
limited by fatigue failure of a single solder joint in reversed cyclic loading. Fatigue damage …

Solder joints in electronic assemblies are subjected to mechanical and thermal cycling.
These cyclic loadings lead to the fatigue failure of solder joints involving damage …

The reliability of an electronic assembly is limited by a fatigue failure of one of the
interconnected solder joints. Fatigue properties of the common lead free solder joints have …

The electronics industry is increasingly prioritizing the reliability of SnAgCu (SAC)-based
alloys due to environmental concerns related to lead-based alloys. Considering the frequent …

Solder joints in electronic assemblies are subjected to mechanical cycling in normal
operating conditions. Testing individual solder joint in mechanical cycling allows monitoring …

To ensure durable performance and optimal function of electronic components, it is crucial to
guarantee their reliability, robustness and goodness of fit. The solder joints used in the BGA …

The reliability of an electronic assembly is typically limited by the failure of one of the solder
interconnections. One of the key factors that define the quality of solder interconnections is …

ABSTRACT A significant reliability problem with the baseline alloy SAC305 is the
deterioration of their mechanical properties and recrystallization of the microstructure after …