With the electronics packaging industry shifting increasingly to three-dimensional
packaging, microbumps have been adopted as the vertical interconnects between chips …

The reach and impact of the Internet of Things will depend on the availability of low-cost,
smart sensors—“low cost” for ubiquitous presence, and “smart” for connectivity and …

Abstract Direct Cu-to-Cu bonding was achieved at temperatures of 150–250° C using a
compressive stress of 100 psi (0.69 MPa) held for 10–60 min at 10− 3 torr. The key …

(57) ABSTRACT A metallic dopant element having a greater oxygen-affinity than copper is
introduced into, and/or over, Surface portions of copper-based metal pads and/or Surfaces …

We achieve low-temperature Cu-to-Cu direct bonding using highly (1 1 1)-orientated Cu
films. The bonding temperature can be lowered to 200° C at a stress of 114 psi for 30 min at …

To overcome the scale-down dilemma of solder-based microbumps, copper-to-copper direct
bonding has emerged to be one of the most promising approaches to replace solder joints in …

Cu-Cu direct bonding has provided an alternative packaging method to circumvent various
issues that arise in conventional Cu/Sn/Cu interconnects, and has potential applications in …

As semiconductor device scaling faces a severe technical bottleneck, vertical die stacking
technologies have been developed to obtain high performance, high density, low latency …

Memory-on-logic and sensor-on-logic face-to-face stacking are emerging design
approaches that promise a significant increase in the performance of modern systems-on …

2013-05-30 Assigned to INTERNATIONAL BUSINESS MACHINES CORPORATION
reassignment INTERNATIONAL BUSINESS MACHINES CORPORATION ASSIGNMENT OF …