[HTML][HTML] Effects of varying the fin width, fin height, gate dielectric material, and gate length on the DC and RF performance of a 14-nm SOI FinFET structure

NEI Boukortt, TR Lenka, S Patanè, G Crupi - Electronics, 2021 - mdpi.com
The FinFET architecture has attracted growing attention over the last two decades since its
invention, owing to the good control of the gate electrode over the conductive channel …

FinFET to GAA MBCFET: A Review and Insights

RR Das, TR Rajalekshmi, A James - IEEE Access, 2024 - ieeexplore.ieee.org
This review article presents a journey from Fin-shaped field effect transistor (FinFET) to gate-
all-around multi-bridge channel field effect transistor (GAA MBCFET) technology, unraveling …

Novel process integration flow of germanium-on-silicon FinFETs for low-power technologies

S Choudhary, M Yogesh, D Schwarz… - Journal of Vacuum …, 2023 - pubs.aip.org
Germanium channel FinFET transistors process integration on a silicon substrate is a
promising candidate to extend the complementary metal–oxide–semiconductor …

Investigation on TG n-FinFET parameters by varying channel doping concentration and gate length

N Boukortt, B Hadri, S Patanè, A Caddemi, G Crupi - Silicon, 2017 - Springer
In this paper, a 3D process of a nanometric n-channel fin field-effect transistor (FinFET) is
discussed and the impact of variations of the fin parameter, the gate work function, and …

Mathematical Modeling and Performance Evaluation of 3D Ferroelectric Negative Capacitance FinFET

SU Alam, R Uddin, MJ Alam, A Raihan… - … and Simulation in …, 2022 - Wiley Online Library
Ferroelectric negative capacitance materials have now been proposed for lowering
electronics energy dissipation beyond basic limitations. In this paper, we presented the …

Comparative performance of the ultra-short channel technology for the DG-FinFET characteristics using different high-k dielectric materials

N Bourahla, A Bourahla, B Hadri - Indian Journal of Physics, 2021 - Springer
The downscaling of the SOI-MOSFET device has an important role of the advanced
technology in the semiconductor industry, so the researchers aim to find the structure which …

Reliable and ultra-low power approach for designing of logic circuits

SU Haq, VK Sharma - Analog Integrated Circuits and Signal Processing, 2024 - Springer
The principal design concern in today's very large-scale integration (VLSI) industry is power
dissipation. Power dissipation in a chip rises reliability issues. Static power dissipation …

3D investigation of 8-nm tapered n-FinFET model

N Boukortt, S Patanè, G Crupi - Silicon, 2020 - Springer
The miniaturization has become a key word for advanced integrated circuits over the last few
years. It is within this context that the fin field effect transistor (FinFET) has appeared as a …

Impact of fin width on nano scale tri-gate FinFET including the quantum mechanical effect

S Panchanan, R Maity, A Baidya… - Engineering Research …, 2023 - iopscience.iop.org
Impact of fin width on nano scale tri-gate FinFET including the quantum mechanical effect -
IOPscience Skip to content IOP Science home Accessibility Help Search Journals Journals list …

Impact of temperature on radio frequency/linearity and harmonic distortion characteristics of Ge multi‐channel fin shaped field‐effect transistor

RR Das, S Maity, A Chowdhury… - International Journal of …, 2022 - Wiley Online Library
This dissertation demonstrates the reliability issues associated with the temperature of Ge
multi‐channel fin shaped field‐effect transistor (Mch‐FinFET). Temperature dependence on …