Atomic layer deposition (ALD) has been studied for several decades now, but the interest in
ALD of metal and nitride thin films has increased only recently, driven by the need for highly …

There are more than 200 different methods for measuring adhesion, suggesting it to be
material, geometry and even industry specific. This availability has exploded at least partly …

This overview article on diamond-like carbon (DLC) coatings in medical applications covers
the interaction of cells and tissue with DLC and alloyed DLC to generate desired cell …

Continual scaling of on-chip wiring structures has brought significant challenges for
materials and processes beyond the 32-nm technology node in microelectronics. Recently …

A relationship between the adhesion of a Cu conductor to its surrounding medium, the
electromigration drift velocity, and lifetime in a conventional electromigration test has been …

Tantalum (Ta) and tantalum nitride thin films are highly important as diffusion barriers and
adhesion layers in microelectronics and hard coatings for cutting tools. In this study, the …

Cyclic fatigue, ie, delayed failure under cyclically varying loads, is the most pervasive, yet
least understood, form of fracture, accounting for 80% or more of all" in-service" failures. It is …

The effects of plasticity in thin copper layers on the interface fracture resistance in thin-film
interconnect structures were explored using experiments and multiscale simulations …

An introduction to the exciting and continuously growing topic of IC packaging is presented
herein. This review starts with a beginner's level introduction to microelectronic packaging …

Physico-chemical mechanisms of adhesion and debonding at the various surfaces and
interfaces of semiconductor devices, integrated circuits and microelectromechanical systems …