[图书][B] Encapsulation technologies for electronic applications

H Ardebili, J Zhang, MG Pecht - 2018 - books.google.com
Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated,
comprehensive discussion of encapsulants in electronic applications, with a primary …

Mechanical reliability of thick films for high-temperature packaging

Z Zhou, RW Johnson… - IEEE Transactions on …, 2018 - ieeexplore.ieee.org
High-temperature electronics are required to reliably operate at 300° C in gas and oil
exploration and downhole drilling for geothermal energy applications. Advances in SiC and …

Evaluation of thick-film materials for high-temperature packaging

Z Zhou, J Cui, F Yu, RW Johnson… - IEEE Transactions on …, 2018 - ieeexplore.ieee.org
High-temperature electronics are required for applications such as automotive, down-hole
drilling for oil and geothermal energy, aircraft, and space exploration. SiC and GaN devices …

High temperature electronics packaging: An overview of substrates for high temperature

D Shaddock, L Yin - 2015 IEEE International Symposium on …, 2015 - ieeexplore.ieee.org
High temperature electronics (> 200° C) is an emerging technical area in electronics that
requires new materials and processes or existing materials and processes in new ways …

Additively Manufactured Extreme Temperature Electronics Packaging

D Shaddock, C Hoel, N Stoffel… - 54th International …, 2021 - meridian.allenpress.com
There is growing interest in extreme temperature electronics to support the mission needs to
sense, actuate, and communicate at temperatures beyond the normal range of operations in …

Fabrication, Characterization, and Performance Assessment of Flexible Hybrid Electronics Using Aerosol Jet Printing

MA Alhendi - 2021 - search.proquest.com
Abstract Flexible Hybrid Electronics (FHE) has gained considerable attentions from many
fields including wearable health and point of care, assets process and their heath …

DIP test socket characterization for 300° C

D Shaddock, L Yin, Z Shen, Z Zhou… - Additional Papers …, 2013 - meridian.allenpress.com
Demonstrating functional reliability testing of high temperature electronic devices for long
lifetime at 300° C requires electrical test fixtures with even better reliability. Advances in …

Conductive mechanism of bi-doped thick-film dielectric in high-temperature aging with bias

Z Zhou, RW Johnson… - IEEE Transactions on …, 2018 - ieeexplore.ieee.org
The increase in high-temperature electronic applications is a challenge for the reliability of
electronic packaging. Thick-film technology has the potential of operating at 300° C. In a …

Die Attach for High Temperature Applications

Z Shen - 2014 - search.proquest.com
The energy sector is seeing dynamic growth with advanced oil and gas recovery methods
being deployed. Measure-while-drilling (MWD) and downhole production instrumentation is …