Currently, the portable electronic products trend to high speed, light weight, miniaturization
and multifunctionality. In that field, solder joint reliability in term of both drop impact and …

Abstract Sn-Ag-Cu (SAC) alloy is currently recognized as the standard lead-free solder alloy
for packaging of interconnects in the electronics industry, and high-Ag-content SAC alloys …

This paper presents a multi-scale modelling approach to investigate the underpinning
mechanisms of microstructure-sensitive damage of single crystal Sn-3Ag-0.5 Cu (wt …

The size and crystal orientation of Sn grains in Pb-free, near eutectic Sn-Ag-Cu solder joints
were examined. A clear dependence of the thermomechanical fatigue response of these …

The recrystallization of β-Sn profoundly affects deformation and failure of Sn-Ag-Cu solder
joints in thermomechanical fatigue (TMF) testing. The numerous grain boundaries of …

Because typical solder joints undergo thermal aging during use, models simulating the
behaviors of solder under mechanical stress must accurately reflect the changes in …

In the service of electronic products, owing to thermal cycling and external additional loads,
solder joints undergo thermomechanical coupled cyclic loading. To fully understand the …

The directional coefficient of thermal expansion (CTE) of intermetallics in electronic
interconnections is a key thermophysical property that is required for microstructure-level …

Thermomechanical fatigue in lab-type Sn–Ag–Cu solder interconnections between two
copper plates has been investigated under cyclic thermal loading within a number of …

Based on crystal plastic theory, a novel thermomechanical constitutive model was proposed
for Sn‐rich solder. Material parameters of the proposed constitutive model were determined …