Interrogation of accrued damage and remaining life in field-deployed electronics subjected to multiple thermal environments of thermal aging and thermal cycling
Field deployed electronics may accrue damage due to environmental exposure and usage
after finite period of service but may not often have any macro-indicators of failure such as …
after finite period of service but may not often have any macro-indicators of failure such as …
Prognostic health monitoring for a micro-coil spring interconnect subjected to drop impacts
In an effort to meet reliability requirements for long term human presence in space without
the need for resupply, a new interconnect for grid array packages has been developed. The …
the need for resupply, a new interconnect for grid array packages has been developed. The …
Interrogation of thermo-mechanical damage in field-deployed electronics
Field deployed electronics may accrue damage due to environmental exposure and usage
after finite period of service but may not often have any macro-indicators of failure such as …
after finite period of service but may not often have any macro-indicators of failure such as …
DIC Based Investigation Into the Effect of Mean Temperature of Thermal Cycle on the Strain State in SnAgCu Solder Joint
Electronics in high reliability applications may be subjected to cyclic thermo-mechanical
loads after being deployed for extended periods of time in harsh environment. Cyclic thermal …
loads after being deployed for extended periods of time in harsh environment. Cyclic thermal …
Leading indicator based assessment of operational readiness in electronics subjected to multiple environments
Field deployed electronics may accrue damage due to environmental exposure and usage
after finite period of service but may not often have any macro-indicators of failure such as …
after finite period of service but may not often have any macro-indicators of failure such as …
Accrued damage and remaining life in field extracted assemblies under sequential thermo-mechanical loads
Field deployed electronics may accrue damage due to environmental exposure and usage
after finite period of service but may not often have any macro-indicators of failure such as …
after finite period of service but may not often have any macro-indicators of failure such as …
Damage Characterization for Electronic Components Under Impact Loading
S Sihn, CLH Devlin, SR Dooley, AK Roy… - Fracture, Fatigue, Failure …, 2017 - Springer
A new experimental method has been develop to characterize critical interfacial damage
parameters of solder interconnects subjected to high strain-rate mechanical loading …
parameters of solder interconnects subjected to high strain-rate mechanical loading …
Damage Pre-Cursors Based Assessment of Accrued Thermo-Mechanical Damage and Remaining Useful Life in Field Deployed Electronics
Field deployed electronics may accrue damage due to environmental exposure and usage
after finite period of service but may not often have any macro-indicators of failure such as …
after finite period of service but may not often have any macro-indicators of failure such as …
Leading Indicators for Prognostication of Impending Failures on Cu-Al Interconnects
P Lall, S Deshpande - … Technical Conference and …, 2013 - asmedigitalcollection.asme.org
Wire bonding is predominant mode of interconnect in electronics packaging. Traditionally
material used for wire bonding is gold. But industry is slowly replacing gold wire bond by …
material used for wire bonding is gold. But industry is slowly replacing gold wire bond by …