In this brief, a low-loss self-packaged Ka-band LTCC filter is proposed based on an artificial
multi-mode substrate integrated waveguide (SIW) resonator. Two ridges and two metal strips …

The evolution of electronic packaging technology towards the adoption of glass substrates
marks a significant advancement in overcoming the constraints posed by traditional organic …

This brief proposes compact and planar substrate integrated waveguide (SIW)-based filters
for single and triple band operations using two quarter-mode SIW (QMSIW) cavities. Two …

This article presents the design and demonstration of a high-bandwidth antenna-in-package
(AiP) module focusing on low-loss interconnects and Yagi-Uda antenna performance …

This article presents a design of Ka-band absorptive filtering packaging antenna (AFPA)
based on through-glass vias (TGVs). Compared to other reflective filtering antennas (RFAs) …

Key challenges of on‐chip integration, including limited scalability, high cost, difficulty to
maintain profitable yield, and increased thermal management complexity, suggest that …

This article presents a substrate integrated waveguide (SIW) filter power divider (FPD)
based on glass substrate with a wide stopband. Couplings of TE 101 and TE 103 modes …

This paper reports the electrical transmission performance characterization of glass
substrate for millimeter-wave (mm-W) application. Glass is a competitive material for mm-W …

In this paper, a conductor-backed coplanar waveguide with sine edges (CBCPW-SE),
consisting of a conductor-backed coplanar with periodic sine edges supported by a …

Despite the low cost and easy fabrication afforded by 3D printing technology, high dielectric
loss of the 3D printing filament degrades the performance of 3D printed radio frequency …