The system-in-package (SiP) has gained much interest in the current rapid development of
integrated circuits (ICs) due to its advantages of integration, shrinking, and high density. This …

In this study, the recent advances and trends in multiple system and heterogeneous
integration with through-silicon via (TSV)-less interposer (organic interposer or 2.3-D IC …

There are at least five different chiplet design and heterogeneous integration packaging,
namely (1) chip partition and heterogeneous integration (driven by cost and technology …

Chiplet-based packaging technology integrates multiple heterogeneous dies with different
functions and materials into a single system as a LEGO-based approach using advanced …

Future processes and materials are needed to enable multichip packages with chip-to-chip
(C2C) data rates of 50 GB/s or higher. This presents a fundamental challenge because of …

Advanced integration and packaging will drive the scaling of computing systems in the next
decade. Diversity in performance, cost and scale of the emerging systems implies that …

Recently, as an alternative solution for overcoming the scaling-down limitations of logic
devices with design length of less than 3 nm and enhancing DRAM operation performance …

Flip chip is one of the chip-level interconnects and has been used for highperformance and
high-density applications such as central processing unit, graphic processing unit, and …

3D heterogeneous integration is an evolving segment of the world semiconductor industry
roadmap to enable improvements in device performance beyond Moore's law expectations …

Today, various heterogeneously integrated package structures have been studying, for
example, 2.1 D, 2.3 D, and 2.5 D advanced package. Especially, the 2.5 D package using …