Design and demonstration of power delivery networks with effective resonance suppression in double-sided 3-D glass interposer packages
Ultrathin 3-D glass interposers with throughpackage vias at the same pitch as through-
silicon vias (TSVs) have been proposed as a simpler and cheaper alternative to the direct 3 …
silicon vias (TSVs) have been proposed as a simpler and cheaper alternative to the direct 3 …
Experimental and theoretical assessment of thin glass substrate for low warpage
S McCann, V Smet, V Sundaram… - IEEE Transactions …, 2017 - ieeexplore.ieee.org
This paper compares the warpage after lead-free solder assembly of ultrathin glass and
organic substrates for microelectronic packages. Smart mobile devices demand packages to …
organic substrates for microelectronic packages. Smart mobile devices demand packages to …
Magnetic field-assisted self-wound 3-D nanomembrane capacitors bridge the gap between MLCC and trench capacitor technologies
F Gabler, OG Schmidt - IEEE Transactions on Components …, 2020 - ieeexplore.ieee.org
This letter reports the transformation of large-area planar metal-insulator-metal (MIM)
nanomembrane capacitors into compact tubular 3-D architectures. By combining the …
nanomembrane capacitors into compact tubular 3-D architectures. By combining the …
Fabrication and integration of ultrathin, high-density, high-frequency ta capacitors on silicon for power modules
P Chakraborti, N Neuhart, KP Rataj… - 2016 IEEE 66th …, 2016 - ieeexplore.ieee.org
This paper demonstrates silicon-integrated, thinfilm, high-density tantalum capacitors for
integrated power modules. The capacitors in form-factors of less than 75μm showed stable …
integrated power modules. The capacitors in form-factors of less than 75μm showed stable …
Studies of interfacial adhesion and copper plating chemistry for metallization of through-package-vias in glass interposers
T Huang - 2017 - repository.gatech.edu
High quality copper plating in blind-vias and through-vias is crucial to achieve high electrical
performance and reliability from the integrated circuit (IC) to the package substrate and …
performance and reliability from the integrated circuit (IC) to the package substrate and …
Thermal Isolation of High Power Devices in Heterogeneous Integration
MC Fish - 2017 - search.proquest.com
Heterogeneous integration (HI) technologies present an important development in the
pursuit of higher performance and reduced size, weight, power and cost of electronic …
pursuit of higher performance and reduced size, weight, power and cost of electronic …
[PDF][PDF] Nanoscale electrode and dielectric materials, processes and interfaces to form thin-film tantalum capacitors for high-frequency applications
P Chakraborti - 2016 - repository.gatech.edu
Smart systems have continuously evolved with the integration of computing, communication,
power, and sensing functions that utilize heterogeneous technologies such as digital, RF …
power, and sensing functions that utilize heterogeneous technologies such as digital, RF …
[引用][C] THERMAL ISOLATION AND DIFFERENTIAL COOLING OF HETEROGENEOUSLY INTEGRATED DEVICES
S DIRECTORATE - 2016