We review the current state-of-the-art graphene-enhanced thermal interface materials for the
management of heat in the next generation of electronics. Increased integration densities …

We investigated thermal properties of the epoxy-based composites with the high loading
fraction—up to f≈ 45 vol%—of the randomly oriented electrically conductive graphene fillers …

The thermal properties of epoxy‐based binary composites comprised of graphene and
copper nanoparticles are reported. It is found that the “synergistic” filler effect, revealed as a …

The synthesis and characterization of epoxy‐based composites with few‐layer graphene
fillers, which are capable of dual‐functional applications, are reported. It is found that …

Abstract Development of next‐generation thermal interface materials (TIMs) with high
thermal conductivity is important for thermal management and packaging of electronic …

We report on the thermal and electrical properties of hybrid epoxy composites with graphene
and boron nitride fillers. The thicknesses, lateral dimensions, and aspect ratios of each filler …

We report on the synthesis of the epoxy-based composites with graphene fillers and test
their electromagnetic shielding efficiency by the quasi-optic free-space method in the …

We report on the lifespan evolution of thermal diffusivity and thermal conductivity in curing
epoxy-based thermal interface materials with graphene fillers. The performance and …

Hexagonal boron nitride (h-BN) nanoplatelets (0.6 μm in diameter and 100 nm in thickness)
are introduced into epoxy resin to improve the polymer's thermal conducting ability. As …

We review the current state of the art of graphene-enhanced thermal interface materials for
the management of heat the next generation of electronics. Increased integration densities …