A new cellular automaton (CA) model of abnormal grain growth (AGG) that considers anisotropic grain boundary energies was developed in this paper. The anisotropic grain …
Q Yu, SK Esche - Materials letters, 2003 - Elsevier
Power-law kinetics was obtained previously from grain growth simulations in isotropic, single-phase materials using three-dimensional (3D) Monte Carlo (MC) Potts models but the …
I Toda-Caraballo, C Capdevila, G Pimentel… - Computational materials …, 2013 - Elsevier
An analytical study of grain growth dynamics complemented with Vertex simulations is presented in this work. This has been done by including the effect of the two main drag …
B Su, Z Han, B Liu - ISIJ international, 2013 - jstage.jst.go.jp
A cellular automaton model has been developed to simulate the austenite nucleation and growth of hypoeutectoid steel during heating process. In the model, the dissolution of …
N Moelans, F Spaepen, P Wollants - Philosophical Magazine, 2010 - Taylor & Francis
The evolution of fibre textured structures is simulated in two dimensions using a generalised phase field model assuming two forms for the misorientation dependence of the grain …
Y Liu, L Cheng, Q Zeng, Z Feng, J Zhang, J Peng… - Materials & Design, 2014 - Elsevier
A two-dimensional numerical model of microstructural effects is presented, with an aim to understand the mechanical performance in polycrystalline materials. The microstructural …
We apply phase-field simulations in two dimensions to study the thermal coarsening of grain boundary (GB) networks with high fractions of twin and twin-variant boundaries, which for …
Q Yu, M Nosonovsky, SK Esche - International Journal of Mechanical …, 2009 - Elsevier
The grain growth in single-phase systems with various anisotropic boundary energies is simulated using a modified two-dimensional (2D) Monte Carlo algorithm. Structural self …
S Chen, T An, F Qin, P Chen - Journal of electronic materials, 2017 - Springer
Through-silicon vias (TSVs) have become an important technology for three-dimensional integrated circuit (3D IC) packaging. Protrusion of electroplated Cu-filled vias is a critical …