With the miniaturization of electronic packaging and devices, the size of solder joints in
electronics is also decreasing from bulk solder joints to micro-bumps. Both the …

The miniaturization of power conversion systems requires high-power density operation of
power modules, causing the heat-density increase. Therefore, it is essential to develop …

Current trend in miniaturization of microelectronic devices is the motivating factor for size
reduction of joints and interconnects. The electronic industry is expecting to reduce the scale …

Solder joint integrity has long been recognized as a key issue affecting the reliability of
integrated circuit packages. In this study, both experimental and finite element simulation …

High temperature storage was conducted on SnAgCu/Fe-Ni (73 wt% Ni and 45 wt% Ni) as
well as SnAgCu/Cu solder joints at 125° C, 150° C, and 175° C to evaluate the diffusion …

The formation of microporosity during solidification of Sn-Bi alloys is investigated through
experiments and simulations. Samples of varying composition with 20, 30, 47 and 58 wt% Bi …

Micro solder joints experience various loads during operation, and the failure of a single
micro solder joint can impact the overall reliability of the entire microsystem. This study …

A strong coupling thermo-mechano-electro-diffusional phase field model is presented and
used to investigating the failure mechanism of a Cu/Sn/Cu solder joint during service and …

As the joints become smaller in more advanced packages and devices, intermetallic (IMCs)
volume ratio increases, which significantly impacts the overall mechanical behavior of joints …

Metastable intermetallics such as NiSn4 occasionally form in solder joints on Ni substrates.
Here it is shown that impurity Fe or soldering to Fe–42Ni substrates promotes metastable …