CMOS-compatible fine pitch Al-Al bonding
HK Cheemalamarri, B Varghese… - 2023 IEEE 73rd …, 2023 - ieeexplore.ieee.org
The metal-metal bonding has become more promising for fine-line hermitic sealing and
electronic packaging applications. Even though aluminum has CMOS compatibility and …
electronic packaging applications. Even though aluminum has CMOS compatibility and …
Die level thinning after bonding on the substrate in 3D packaging
Y Wang, C Hu, X Xiang, W Zheng… - Journal of Physics …, 2023 - iopscience.iop.org
This paper aims to realize heterogeneous integrated packaging technology for high
integration by applying a thinning process technology for controlling the thickness of …
integration by applying a thinning process technology for controlling the thickness of …