A new technique to de-embed the contributions of parasitic structures from transmission line
measurements is presented and applied to microstrip lines fabricated in 90-and 130-nm RF …

Advances in interconnect technologies, such as the increase in the number of metal layers,
stacked vias, and the reduced routing pitch, have played a key role to continuously improve …

SOI devices are frequently used nowadays in the RF and HF field. Design of complex SOI
integrated circuits involves a prior detailed analog simulation, that can only be performed …

In this paper, we present a thru-reflect-line (TRL) calibration/de-embedding kit integrated in
the back-end-of-line of a SiGe technology, which allows direct calibration at the first …

The effective resistivity (ρeff) is a figure of merit commonly used to assess the radio-
frequency performance of a substrate from the measurements of coplanar waveguide lines …

This paper presents a quantitative comparison of the reference multiline TRL and LRM+ for
a customized set of standards in a CMOS process using IBM's 0.13 mum technology. This …

Characteristic-Impedance Measurement Error on Lossy Substrates Page 1 Publication of the
National Institute of Standards and Technology, not subject to copyright. This work was …

In this paper, we propose a method based on 3-D electromagnetic simulations, for the
characteristic impedance extraction of transmission lines employed in TRL calibration …

In this paper, a unified method is introduced and formulated for deriving the equivalent
circuit model of a guided wave structure as well as its characteristic impedance for any …

This paper presents a hybrid method that combines measurements, electromagnetic (EM)
numerical tools, and extrapolation techniques for accurate modeling of lossy multi …