The idea of using through-silicon-via (TSV) technology has been around for many years.
However, this technology has only recently been introduced into high volume …

Nanoelectronics is changing the way the world communicates, and is transforming our daily
lives. Continuing Moore's law and miniaturization of low-power semiconductor chips with …

Physical failure analysis (PFA) gives unparalleled insight into the nature of microelectronic
structures and their defects. Developments in 3-D integration and packaging techniques …

In this paper a review of the development of x-ray computed tomography (CT) for non-
destructive failure analysis in microelectronics packages and boards is presented. The …

In this paper a review of the development of x-ray computed tomography (CT) for non-
destructive failure analysis in microelectronics is presented. The general operation principle …

Solder connections provide an electrical and mechanical connection between components
and PCB (Printed Circuit Board) in electronic devices. It is very important to develop a …

3D packing technologies integrate different components in three dimensions in one device
to increase performance, functional density and reduce the devices footprint. Due to the …

System in Package (SiP) technology is rapidly evolved from specialty technology used in a
narrow set of applications to a high volume technology with wide ranging impact on …

X-Ray computed tomography (CT) can be useful in evaluating defects in through-silicon vias
(TSVs). X-Ray CT images of two different TSV processes are presented; copper TSVs used …

3D packaging has become a popular technology along with the tendency of functionality
and portability for electronic devices. Conventional fault isolation techniques face a great …