Manipulation of terahertz radiation opens new opportunities that underpin application areas
in communication, security, material sensing, and characterization. Metasurfaces employed …

As a powerful enabling technology, three-dimensional (3D) integration, which uses wafer
bonding to integrate multiple wafers in the vertical direction and uses through‑silicon-vias …

The emerging fields of silicon (Si) photonic micro–electromechanical systems (MEMS) and
optomechanics enable a wide range of novel high-performance photonic devices with ultra …

An anti-oxidant Cu layer was achieved by remote mode N2 plasma. Remote mode plasma
treatment offers the advantages of having no defect formation, such as pinholes, by …

The development of 5G mobile communication created the need for high-frequency
communication systems, which require vast quantities of radio frequency (RF) filters with a …

In this study, Ni particle was validated as an effective grain refiner for the Cu-Sn solid-liquid
interdiffusion (SLID) wafer bonding joints, which induced a dispersive non-interfacial …

In this paper, a two-step copper-copper direct bonding process in a non-vacuum
environment is reported. Time-dependent evolution of argon/nitrogen plasma-activated …

Wafer-level solid liquid interdiffusion (SLID) bonding, also known as transient liquid-phase
bonding, is becoming an increasingly attractive method for industrial usage since it can …

In this work, SiNx/a-Si/SiNx caps on conductive coplanar waveguides (CPWs) are proposed
for thin film encapsulation of radio-frequency microelectromechanical systems (RF MEMS) …

Glass frit bonding is a widely used technology to cap and seal micro-electromechanical
systems on the wafer level using a low melting point glass. Screen printing is the main …