A support die includes complementary metal-oxide-semiconductor (CMOS) devices, front
support-die bonding pads electrically connected to a first subset of the peripheral circuitry …

Integrated fan-out packages and methods of forming the same are disclosed. An integrated
fan-out package includes a first semiconductor chip, a plurality of through integrated fan-out …

A thermal-interface-material (TIM)-free thermal management apparatus includes a thermally-
conductive unitary structure having an integrated circuit (IC) side and cooling system side …

A cooling module used in conjunction with a heating element includes a vapor chamber and
a plurality of cooling fins. The vapor chamber is in contact with one side of the heating …

H10B43/23—EEPROM devices comprising charge-trapping gate insulators characterised by
three-dimensional arrangements, eg with cells on different height levels with source and …

High thermal performance microelectronic modules containing thermal extension levels are
provided, as are methods for fabricating such microelectronic modules. In various …

A semiconductor device package structure is provided, which includes a substrate, one or
more dies coupled to the substrate, and a heat pipe device. In an example, the heat pipe …

Photonic and electronic integrated circuits can be cooled using variable conductance heat
pipes containing a non-condensable gas in addition to a phase-changing working fluid. To …

An apparatus for cooling an electronic device is disclosed. In an aspect, the apparatus
includes a vapor chamber coupled to a heat generating component of the electronic device …

A thermal-interface-material (TIM)-free thermal management apparatus includes a thermally-
conductive unitary structure having an integrated circuit (IC) side and cooling system side …