Integration of III-V lasers on Si for Si photonics

M Tang, JS Park, Z Wang, S Chen, P Jurczak… - Progress in Quantum …, 2019 - Elsevier
Abstract Development of Si photonic integrated circuits (PICs) has been impeded due to lack
of efficient Si-based light-emitting sources. Because of their indirect bandgap, bulk Ge and …

Silicon photonics: a review of recent literature

R Soref - Silicon, 2010 - Springer
This review presents a distillation of important results published during 2009 in major
journals and conference proceedings. Although the commercial promise of silicon photonics …

III-V/Si hybrid photonic devices by direct fusion bonding

K Tanabe, K Watanabe, Y Arakawa - Scientific reports, 2012 - nature.com
Monolithic integration of III-V compound semiconductors on silicon is highly sought after for
high-speed, low-power-consumption silicon photonics and low-cost, light-weight …

Continuous-wave quantum dot photonic crystal lasers grown on on-axis Si (001)

T Zhou, M Tang, G Xiang, B Xiang, S Hark… - Nature …, 2020 - nature.com
Semiconductor III–V photonic crystal (PC) laser is regarded as a promising ultra-compact
light source with unique advantages of ultralow energy consumption and small footprint for …

Integration of III–V materials and Si-CMOS through double layer transfer process

KH Lee, S Bao, E Fitzgerald… - Japanese Journal of …, 2015 - iopscience.iop.org
A method to integrate III–V compound semiconductor and SOI-CMOS on a common Si
substrate is demonstrated. The SOI-CMOS layer is temporarily bonded on a Si handle wafer …

Electrically pumped 1.3 μm room-temperature InAs/GaAs quantum dot lasers on Si substrates by metal-mediated wafer bonding and layer transfer

K Tanabe, D Guimard, D Bordel, S Iwamoto… - Optics express, 2010 - opg.optica.org
An electrically pumped InAs/GaAs quantum dot laser on a Si substrate has been
demonstrated. The double-hetero laser structure was grown on a GaAs substrate by metal …

Recent advances of heterogeneously integrated III–V laser on Si

X Guo, A He, Y Su - Journal of Semiconductors, 2019 - iopscience.iop.org
Due to the indirect bandgap nature, the widely used silicon CMOS is very inefficient at light
emitting. The integration of silicon lasers is deemed as the'Mount Everest'for the full take-up …

Integration of GaAs, GaN, and Si-CMOS on a common 200 mm Si substrate through multilayer transfer process

KH Lee, S Bao, L Zhang, D Kohen… - Applied Physics …, 2016 - iopscience.iop.org
The integration of III–V semiconductors (eg, GaAs and GaN) and silicon-on-insulator (SOI)-
CMOS on a 200 mm Si substrate is demonstrated. The SOI-CMOS donor wafer is …

Method of manufacturing a substrate

KH Lee, CS Tan, EA Fitzgerald, EKK Lee - US Patent 10,049,947, 2018 - Google Patents
(57) ABSTRACT A method of manufacturing a substrate is disclosed. The method
comprises: providing a first semiconductor sub strate, which includes an at least partially …

Heterogeneously integrated photonic-crystal lasers on silicon for on/off chip optical interconnects

K Takeda, T Sato, T Fujii, E Kuramochi, M Notomi… - Optics express, 2015 - opg.optica.org
We demonstrate the continuous-wave operation of lambda-scale embedded active-region
photonic-crystal (LEAP) lasers at room temperature, which we fabricated on a Si wafer. The …