J Jeong, SK Kim, YJ Suh, J Shim… - … on Electron Devices, 2024 - ieeexplore.ieee.org
Heterogenous and monolithic 3-D (M3D) integration of III–V RF devices on Si CMOS is a very attractive technology for future wireless communication systems. However, the self …
For operation as power amplifiers in RF applications, high electron mobility transistor (HEMT) structures are subjected to a range of bias conditions, applied at both the gate and …
A comparison of thinned and clustered array configurations is presented where the former is generated by deactivating the radiating elements permanently while the latter is generated …
We report on charge capture and emission in Metal-Oxide-Semiconductor AlGaN/AlN/GaN High-Electron Mobility Transistors (MOS-HEMT) foreseen as power amplifiers in mm-wave …
A Oliveira, O Valorge, C Dubarry… - 2023 53rd European …, 2023 - ieeexplore.ieee.org
In this paper, passive devices integrated in the top-tier level of a 3D homogeneous integration are characterized up to 220 GHz. A three steps de-embedding process is …
D Smellie, R ElKashlan, A Khaled… - 2024 54th European …, 2024 - ieeexplore.ieee.org
This work studies two calibration methods for S-parameter measurements by a real-time oscilloscope (RTO). Vector Network Analyser (VNA) measurements of an active and passive …
АС Ефимов - Известия высших учебных заведений России …, 2023 - cyberleninka.ru
Введение. Достижение высоких характеристик радиоэлектронной системы требует применения комбинации приборов, реализованных на разных полупроводниковых …
AS Efimov - Journal of the Russian Universities, 1998 - re.eltech.ru
Introduction. Enhanced performance of electronic systems can be achieved by heterogeneous integration of different semiconductor technologies. The benefits of …