Ever since RoHS was implemented in 2006, Sn3. 0Ag0. 5Cu (SAC305) has been the
primary lead-free solder for attaching electronic devices to printed circuit boards (PCBs) …

As" micro-containers" for thermal energy storage, microencapsulated phase change
materials (MEPCMs) have gained attention due to their high heat storage density, high …

Due to the advantages of high thermal conductivity, high heat storage density per unit
volume and large specific surface area, metal-based microencapsulated phase change …

The development of hybrid solder for chip packing is a major 3D packaging research topic.
The incorporation of with low melting points into solder materials has been used in low …

Friction stir vibration brazing (FSVB) by application of mechanical vibration was introduced
in this investigation. In the current research, the adjoining samples are vibrated normally to …

While many aspects of electronics manufacturing are controlled with great precision, the
nucleation of tin in solder joints is currently left to chance. This leads to a widely varying melt …

A Cu 6 Sn 5 layer is an integral part of many electronic interconnections. Here we show that,
although primary Cu 6 Sn 5 is not a potent nucleant for Sn, the Cu 6 Sn 5 layer plays a key …

Microstructure of the eutectic region and β-Sn grain of the solder matrix play an important
role in the properties of the Sn-based solder joint. In the present study, Ni and Co …

An ideal microencapsulated phase change material (MEPCM) should have the
characteristics of high thermal reliability, low supercooling degree and high thermal …

Microelectronic devices have demonstrated advanced capabilities, including
multifunctionality and high input-output density, rendering them widely used in significant …