Miniaturization as well as manufacturing processes that electronics devices are subjected to
often results in to increase in operational parameters such as current density, temperature …

In this study, an energy-based three-dimensional (3D) model is created using Surface
Evolver to predict the passive components solder joint shape after reflow soldering. The …

In this paper, we focus on the Electromigration (EM) with three different types of solder
systems, homogeneous SAC305, homogeneous SnBi58 and SAC305-SnBi58 Partial mixed …

Reliability of solder joint is one of the most concerns in the electronic packages. The trend of
smart electronic devices decreases in size and thickness and demands more and more …

Moisture induced failure is one of the major reliability concerns in electronic packaging. This
research provides a comprehensive solution for modeling the moisture induced …

Epoxy-based underfill materials are widely used in microelectronic packaging to reduce
coefficient of thermal expansion (CTE) mismatch between the organic substrate and the …

With the minimization trend of component size, electromigration is becoming an increasingly
important concern. Current studies mainly focused on predicting the EM time to failure (TTF) …

With smaller and denser transistors, the physical flow of electrons may inhibit the
performance of the device over time by forming voids and cracks at interconnects due to …

Current densities for high-performance applications (such as AI/ML, Artificial
Intelligence/Machine Learning) have continued to increase to levels never seen before …

In this study, we combined finite element method (FEM) based on Ansys and Noesis
Optimus software to investigate the effect of bump structures and loading conditions on the …