In this study, an energy-based three-dimensional (3D) model is created using Surface Evolver to predict the passive components solder joint shape after reflow soldering. The …
In this paper, we focus on the Electromigration (EM) with three different types of solder systems, homogeneous SAC305, homogeneous SnBi58 and SAC305-SnBi58 Partial mixed …
Reliability of solder joint is one of the most concerns in the electronic packages. The trend of smart electronic devices decreases in size and thickness and demands more and more …
Moisture induced failure is one of the major reliability concerns in electronic packaging. This research provides a comprehensive solution for modeling the moisture induced …
J Yang, J Xu, S Park - 2020 IEEE 70th Electronic Components …, 2020 - ieeexplore.ieee.org
Epoxy-based underfill materials are widely used in microelectronic packaging to reduce coefficient of thermal expansion (CTE) mismatch between the organic substrate and the …
C Cai, J Xu, Y Lai, J Yang… - International …, 2022 - asmedigitalcollection.asme.org
With the minimization trend of component size, electromigration is becoming an increasingly important concern. Current studies mainly focused on predicting the EM time to failure (TTF) …
C Cai, Z Yang, Y Li, P Jain, T Kang… - … of Microelectronics and …, 2023 - imapsjmep.org
With smaller and denser transistors, the physical flow of electrons may inhibit the performance of the device over time by forming voids and cracks at interconnects due to …
R Labie, C Nawghane, D Tsiakos… - 2024 IEEE 74th …, 2024 - ieeexplore.ieee.org
Current densities for high-performance applications (such as AI/ML, Artificial Intelligence/Machine Learning) have continued to increase to levels never seen before …
L Du, S Deng, Z Cui, R Poelma… - … and Multi-Physics …, 2024 - ieeexplore.ieee.org
In this study, we combined finite element method (FEM) based on Ansys and Noesis Optimus software to investigate the effect of bump structures and loading conditions on the …