The reach and impact of the Internet of Things will depend on the availability of low-cost,
smart sensors—“low cost” for ubiquitous presence, and “smart” for connectivity and …

In this paper, we proposed a depressing bonding temperature method for Cusingle bondCu
bonding with nanoparticle paste. The paste was prepared by composting dominant Cu …

The design of a novel wideband microwave crossover is presented. The proposed structure
is fully compatible with microstrip circuits as it is printed on one side of a single-layer …

Multi-chip bonding in 3D integration always consumes much processing time. This study
provides a novel mechanical interlock bonding (MIB) technology, which can save bonding …

The pretreatment with Ar mixed 5% H 2 plasma was applied to improve surface properties of
electroplated Cu for low temperature Cu-Sn bonding in 3D interconnection. Measurement …

Three critical experiments, including Sn interlayer thickness optimization, interfacial IMC
growth evolution, and bump size effect, have been conducted for low temperature Cusingle …

Metal-to-metal bonding is critical in modern electronics technology such as 3D-IC packaging
and automotive electronics. In this study, we applied Cu core-Ag shell nanoparticle paste …

High-density area-array 3-D interconnects are a key enabling technology for 3-D integrated
circuits. This paper presents results of the fabrication and testing of large 640 by 512 area …

In this work, Ar mixed 5% H2 plasma was applied to improve the surface properties of
electroplated Cu and electroplated Sn for Cu/Sn/Cu solid-state-diffusion (SSD) bonding in …

Solid-liquid interdiffusion (SLID) bonding for microelectronics and microsystems is a
bonding technique relying on intermetallics. The high-melting temperature of intermetallics …