Sn-based lead-free solder alloys have been investigated widely to replace the traditional Sn–
Pb solder alloys. Since the miniaturization of electronic products and the expansion of …

Owing to their superior electrical, thermal, and mechanical properties, solder joints are the
most widely used interconnection materials in electronic product packaging. Because the …

Process-induced voids remain one of the key concerns in thermo-mechanical reliability of
solder alloys. Previous studies reported that the void effect on fatigue failure reliability of …

In this paper, the constitutive response of SnAgCuZn solder was studied under uniaxial
tension. Anand model was used to represent the inelastic deformation behavior of the lead …

Acceleration factors and predictive life models are of use to build-in board assembly
reliability and estimate solder joint life at the design stage. They allow designers to answer …

The interfacial reactions and mechanical properties of Sn-58Bi/Cu solder joints reflowed at
different temperatures ranging from 180 to 220° C for constant time of 10 min were …

Through silicon via (TSV) is a kind of three-dimensional (3D) packaging technology with
great development potential, which can realize short distance electrical interconnection …

This study aims to investigate the effects of thermal aging on microstructure changes, creep
behavior, and corrosion properties of 95.5 wt%-Sn, 3.8 wt%-Ag, 0.7 wt%-Cu (also known as …

SnAgCu solder alloys exhibit significant rate-dependent constitutive behavior. Solder joints
made of these alloys exhibit failure modes that are also rate-dependent. Solder joints are an …

Through silicon via (TSV) is a kind of three-dimensional (3D) packaging technology with
great development potential, which can realize short distance electrical interconnection …