Carbon nanomaterials and their application to electrochemical sensors: a review

AC Power, B Gorey, S Chandra… - Nanotechnology …, 2018 - degruyter.com
Carbon has long been applied as an electrochemical sensing interface owing to its unique
electrochemical properties. Moreover, recent advances in material design and synthesis …

Recent progress and challenges regarding carbon nanotube on-chip interconnects

B Xu, R Chen, J Zhou, J Liang - Micromachines, 2022 - mdpi.com
Along with deep scaling transistors and complex electronics information exchange networks,
very-large-scale-integrated (VLSI) circuits require high performance and ultra-low power …

Analytical study of bundled MWCNT and edged MLGNR interconnects: impact on propagation delay and area

VR Kumbhare, PP Paltani, C Venkataiah… - IEEE Transactions …, 2019 - ieeexplore.ieee.org
This research letter presents an accurate and efficient model for rough-edged multi-layered
graphene nanoribbon (MLGNR) and multi-walled carbon nanotube (MWCNT) bundled …

[PDF][PDF] Investigating the effect of chirality, oxide thickness, temperature and channel length variation on a threshold voltage of MOSFET, GNRFET, and CNTFET

C Venkataiah, VNV Satya-Prakash… - J Mech Continua …, 2019 - researchgate.net
Scaling down of CMOS in Nano meter range has many difficulties such as high leakage
current, smaller gate control, high power consumption, high density, a wide range of …

RF analysis of intercalated graphene nanoribbon-based global-level interconnects

M Kaur, N Gupta, S Kumar, B Raj, AK Singh - Journal of Computational …, 2020 - Springer
Intercalation doping is emerging as a prospective solution to enhance the performance of
graphene nanoribbon interconnects. In this paper, the radio frequency (RF) analysis of stage …

FDTD algorithm to achieve absolute stability in performance analysis of SWCNT interconnects

C Venkataiah, K Satyaprasad, TJ Prasad - Journal of computational …, 2018 - Springer
Crosstalk analysis in very-large-scale (VLSI) interconnects is usually carried out using finite-
difference time-domain (FDTD) methods. However, the stability of FDTD is limited by the …

[图书][B] Through silicon vias: materials, models, design, and performance

BK Kaushik, VR Kumar, MK Majumder, A Alam - 2016 - taylorfrancis.com
Recent advances in semiconductor technology offer vertical interconnect access (via) that
extend through silicon, popularly known as through silicon via (TSV). This book provides a …

Analytical models of high-speed RLC interconnect delay for complex and real poles

MS Ullah, MH Chowdhury - IEEE Transactions on Very Large …, 2017 - ieeexplore.ieee.org
Continuous shrinking of the size of CMOS technology leads to extremely fast devices, but
the resulting interconnect structures impose so many parasitic effects that the advantage of …

Stability analysis in top-contact and side-contact graphene nanoribbon interconnects

S Bhattacharya, D Das, H Rahaman - IETE Journal of Research, 2017 - Taylor & Francis
In this paper, we have analysed the relative stability of copper, top-contact (TC) and side-
contact (SC) multilayer graphene nanoribbon (MLGNR)-based interconnects for next …

Electro-thermal RF modeling and performance analysis of graphene nanoribbon interconnects

S Das, D Das, H Rahaman - Journal of Computational Electronics, 2018 - Springer
This paper presents an electro-thermal radio frequency (RF) model and performance
analysis for multilayer graphene nanoribbon (MLGNR) interconnects. The number of …