Rotation of structures fabricated by planar processing into out-of-plane orientations can be
used to greatly increase the 3-dimensionality of microstructures. Previously this has been …

Self-assembly of three-dimensional microstructures using the surface tension force of molten
solder to produce out-of-plane rotation is demonstrated. The generic nature of the technique …

MEMS (Microelectromechanical Systems) or MST (Microsystem Technology) have been
widely recognized as the next technology revolution that will remarkably change human …

We have developed key technologies to form conductive interconnections through a thick
silicon substrate, which are potentially applied for 3D device fabrication or packaging of …

Surface tension powered self-assembly is a technique for mass parallel fabrication of 3D
micro-electro-mechanical systems (MEMS) from surface micromachined parts, which are …

3D printing of metallic microarchitectures with controlled internal structures is realized at
room temperature in ambient air conditions by the manipulation of metal ion concentration …

We have fabricated very-high-aspect-ratio (VHAR) silicon and metal microstructures in
complex geometric patterns. The recently developed surfactant-added …

A new monolithic integration method for 3-D electroplated microstructures of unlimited
number of levels has been developed using unique planarization with a sacrificial metallic …

Anodic aluminum oxide (AAO) was used as substrates of microstructure fabrication.
Complex structures with high aspect ratios were obtained by the single-step wet etching of …

Multi-height metallic structures are of importance for various MEMS applications, including
master molds for creating 3D structures by nanoimprint lithography, or realizing vertically …