The integration of CMOS electronics with MEMS (micro-electro-mechanical systems) is
attractive because it allows MEMS components to be co-located with their associated control …

We report monolithic integration of MEMS (micro electro mechanical systems) actuators and
high-voltage driver circuits into a silicon chip. Driver circuits of up to 40 V were prepared on …

This paper presents an overview of microelectromechanical systems (MEMS) research
topics. Manufacturing technologies, including bulk and surface micromachining, are …

This paper describes a new post-CMOS technology for co-integrating thick (>; 50 μm) high
aspect ratio MEMS beneath a thin-SOI (1.5 μm) CMOS platform, in the low resistivity SOI …

Summary form only given. The majority of current MEMS products on the market still use a
hybrid approach for the MEMS and the processing circuitry. The disadvantage of a hybrid …

MEMS devices must be packaged to be used. Unfortunately, MEMS packages are
challenging to develop, and the packaging of MEMS devices often dominates the cost of the …

The cointegration of IC microsensors, actuators and readout circuit leads to smart Micro
Electro Mechanical Systems (MEMS) which are superior in many aspects to their …

This paper demonstrates a dry heterogeneous integration process for embedding CMOS
chips into a partially-complete MEMS silicon wafer. By using standard IC processing, we …

In this paper, we report monolithic integration of MEMS (micro electro mechanical systems)
actuators and high-voltage driver circuits into a silicon chip. Driver circuits of up to 40 V were …

Multichip module (MCM) packaging provides an efficient solution to integration of MEMS
with microelectronics. In this paper, new methods of packaging MEMS using two advanced …